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NAVSO
P-3641: Navy Power Supply Reliability Design & Mfg
Guidelines

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3.4 Output Power Density - High Voltage

The packaging of low-voltage power supplies
is driven by thermal considerations. Packaging
of high-voltage power supplies on the other hand
is dominated by "E" field gradients. MIL-STD-454
states that insulation systems having dielectric
withstanding voltages over 300 volts are corona
limited rather than dielectric strength
limited.

Program management must recognize the special
considerations that high voltage places on
mechanical and electrical design
disciplines.

Mechanical packaging of high-voltage power
supplies directly impacts the ultimate
reliability. The failure mechanisms which must
be prevented by proper mechanical design are
insulation breakdown, thermal stress and
mechanical failure. The mechanical layout
dictated by the "E" field analysis establishes
the minimum packaging density. There is an
iterative process involving mechanical layout,
"E" field computation and selection of the
insulation system to prevent insulation
breakdown and corona in the development of a
reliable design.

High-voltage power supplies designed to the
guidelines of Section 5 of this publication do
not conform with the intent of Figure
3-4. However, the dotted lines in Figures
3-2
and 3-3
are typical of
high-voltage designs.