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NAVSO
P-3641: Navy Power Supply Reliability Design & Mfg
Guidelines

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1.0 Introduction

Navy program reviews and fleet experience
throughout the 1970s consistently revealed that
the most serious and prevalent reliability
problem with electronic systems was power
supplies. In late 1979, the Deputy Chief of
Naval Material for Reliability, Maintainability,
and Quality Assurance requested from each
Systems Command a list of power supply
manufacturers among its contractors and their
suppliers. A subsequent letter to some 170
companies in 1980 highlighted the Navy's concern
and sought assurance that adequate attention was
being given to power supply reliability in
accordance with the Navy's then-new reliability
initiatives.

The industry replies to that letter pointed
up four major problem areas: inadequate design
analysis and derating; inadequate manufacturing
screening; late design specification; and
unqualified low bidders. The Navy responded by
convening a Navy/Industry Power Supply
Conference in Washington on 2 April 1981 to
discuss these problems and their potential
solutions. The proceedings of this conference
made it clear that the power supply problem was
not a simple one and would require continuing
effort to resolve.

Following the April 1981 conference, the Navy
chartered a Navy/Industry Power Supply Ad Hoc
Committee staffed by technical experts to
identify the best design practices and
manufacturing processes for low-voltage
switching-mode power supplies. This committee
met several times over the course of a year, and
provided the information contained in the 1982
publication. As the technology of both power
supplies and electronics in general continued to
advance, it became necessary to update the
guidelines of the original publication. This
also provided an opportunity to address the
problems of high-voltage switching-mode power
supplies, whose unique design and manufacturing
requirements are not fully addressed by the
guidelines of low-voltage systems. The original
Navy/Industry Power Supply Ad Hoc Committee was
reconvened and augmented by consultants in
high-voltage technology. This revised and
expanded publication is the result of the work
by this enlarged committee over a two-year
period.

The Navy wishes to acknowledge both the
original and the new committee members and to
express appreciation to them and their
affiliation for their extensive contributions.
Chairman of both committees is Donald Hornbeck.
Industry members of the original committee
included Gwinn Almond, Anthony Annunziato,
Dwayne Attaway, Richard Blake, Gerald Brode,
Joseph Craddock, John Donnelly, Jerrold Foutz,
Myron Pogue, and Tony Wilson. Navy members
included Randy Collins, Bud Gibson, John Jentz,
and Douglas Patterson. The committee secretary
and editor was Elwood Padgett.

This new edition is the work of the
following:

EXECUTIVE COMMITTEE

D. Hornbeck, Chairman Beck Associates

D. O. Patterson, Co-chairman
ASN(S&L)RM&QA
J. C. Wright,
Secretary GE
L. A. Witt, Editor
GE

SUBCOMMITTEE ON COMPONENTS

B. J. White Raytheon
A. G. Cinque
ITT
R. Collins NWSC
H. Franklin
Rockwell (ret)
C. A. Martin Raytheon

M. Pogue Adv. Power Tech.
B. L. Scherer
Hughes
R. W. Smith EG&G Almond

P. E. Thibodeau Hughes
J. C. Wright
GE
F. Zollner Rantec Power
Systems

SUBCOMMITTEE ON DESIGN REVIEW
CHECKLIST

C. McNemar Loral Systems Group
J. M.
Bowyer Loral Systems Group
G. D. Brode
IBM
B. L. Scherer Hughes
W. C.
Singleton IBM
F. Zollner Rantec Power
Systems

SUBCOMMITTEE ON ENVIRONMENTAL STRESS
SCREENING

D. Monteith DOM Engineering
W. C.
Singleton IBM
J. M. Bowyer Loral
Systems Group
R. J. Lapp CEAG
C. W.
McNemar Loral Systems Group

SUBCOMMITTEE ON HIGH VOLTAGE

C. McNemar Loral Systems Group
J. M.
Bowyer Loral Systems Group
D. E. Cavenaugh
Espey
W. H. Dockery Tecnetics
J. Jentz
Naval Avionics Center
D. Mcllvoy
OECO
C. L. Payne Varo
B. L. Scherer
Hughes
D. Schimelpfenig Eldec
P. E.
Thibodeau Hughes
F. A. Wilhelmi Rantec
Power Systems
J. Williams Eldec

SUBCOMMITTEE ON INPUT POWER
CHARACTERISTICS

J. C. Wright GE
G. D. Brode
IBM

SUBCOMMITTEE ON MANAGEMENT &
STANDARDIZATION

R. Collins NWSC
W. C. Singleton
IBM

SUBCOMMITTEE ON MANUFACTURING
GUIDELINES

G. D. Brode IBM
J. M. Bowyer Loral
Systems Group
B. L. Scherer Hughes
W.
C. Singleton IBM
R. W. Smith EG&G
Almond

SUBCOMMITTEE ON OUTPUT POWER DENSITY

T. Wilson Transistor Devices
R. J.
Lapp CEAG
A. A. Annunziato UNISYS
W.
H. Dockery Tecnetics
D. Hombeck Beck
Associates
J. Jentz Naval Avionics
Center

SUBCOMMITTEE ON PACKAGING

R. J. Lapp CEAG
T. Wilson
Transistor Devices

SUBCOMMITTEE ON RELIABILITY

D. Monteith DOM Engineering
A. A.
Annunziato UNISYS
R. Blake Transistor
Devices
G. D. Brode IBM
W.H. Dockery
Tecnetics

SUBCOMMITTEE ON SCHEDULE AND COST

W. C. Singleton IBM
R. Blake
Transistor Devices
G. D. Brode
IBM

SUBCOMMITTEE ON STANDARDIZATION

R. Collins NWSC
D. Hornbeck Beck
Associates
J. Jentz Naval Avionics
Center
W. C. Singleton
IBM