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8 Disassembly and Main Component Replacement Procedures

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“ATTENTION SERVICER”

Some chassis components may have sharp edges.

Be careful when disassembling and servicing.

1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main components.

2. For reassembly after operation checks or replacement, reverse the respective procedures.

   Special reassembly procedures are described only when required.

3. Select items from the following index when checks or replacement are required.

Contents

- Checking Procedure for each major P.C.B.

  1. Checking of the Main, Panel, Transformer, Deck P.C.B.

  2. Checking of Power P.C.B.

- Main Component Replacement Procedures

  1. Replacement of the Traverse Deck.

  2. Replacement of the Power Amplifier IC.

- Disassembly and assembly of the Traverse Unit

- Disassembly and assembly of the Disc Tray

Warning:

This product uses a laser diode. Refer to caution statement “Precaution of Laser Diode.

8.1 Checking Procedure for each major P.C.B.

8.1.1 Checking of the Main, Panel, Transformer and Deck P.C.B.

8.2 Main Component Replacement Procedures

8.2.1 Replacement of the Traverse Deck

8.2.2 Replacement of the Power Amplifier IC

8.3 Disassembly and assembly of the Traverse Unit

8.4 Disassembly and assembly of the Disc Tray

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